Embedded PC EPC-T1232
Intel ® 6th Generation Core i mobile ULT CPU, fanless, power efficient 1U THIN embedded PC
- 6th Gen. Intel® Core™ i ULT processor (BGA)
- One 260-pin SO-DIMM up to 16 GB DDR4 2133 MHz SDRAM upto 8GB
- Dual Intel i219/i211 Gigabit LAN
- Shock-resistant one 2.5″ drive bay
- THIN design with 44mm in height
- Support Wall/ VESA/ Din Rail/ Rack mounting module
- Support SUSI, WISE-DeviceOn and Edge AI Suite.
Product Description
- Compatible Motherboard
- AIMB-232G2-U5A1E
- CPU
- 6th Gen. Intel® Core™ i5-6300U
- BIOS
- AMI 16 Mbit SPI
- Thermal Solution
- FANLESS
- Socket
- 1 x 260-Pin SO-DIMM
- Technology
- DDR4 2133MHz
- Max. Capacity
- 8 GB/8 GB per SO-DIMM
- Chipset
- HD Graphics
- mSATA
- 1 (F/S Mini-PCIe)
- 2.5" Drive Bay
- 1 (support 2.5" SSD, max 9.5 mm height)
- Interface
- 10/100/1000 Mbps
- Controller
- GbE1: Intel I219LM, GbE2: Intel I211
- Connector
- 2 (RJ-45)
- Chipset
- Realtek ALC892, High Definition Audio (HD)
- Mini PCIe
- 2 x full size Mini PCIe with (1 with SIM holder, 1 with mSATA)
- Antenna
- up to 2
- Audio
- 2 (Line-Out, Mic-In)
- COM
- 2 COM
- USB
- 2
- DP++
- 1
- HDMI / DisplayPort*
- 1/0
- USB
- 4 (USB3.0)
- Audio
- 2 (Line-out, Mic-In)
- Antenna
- up to 2
- Ethernet
- 2
- Power Input
- 1 (DC Jack)
- LED Indicators
- 2 (Power LED, HDD LED)
- Control
- 1 (Power switch); 1(Reset switch)
- Power Consumption
- Base on motherboard
- Voltage
- 12V DC-in
- Humidity
- 10 ~ 85% @ 40° C, non-condensing
- Non-Operational Temperature
- -20 ~ 60° C (-4 ~ 140° F)
- Operating Temperature
- 0 ~ 45° C (32 ~ 113° F) with 0.7m/s air flow
- Vibration Resistance
- 3 Grms (SSD x 1)
- Weight (kg)
- 3.23 kg
- Dimensions (W x H x D)
- 250 x 43 x 210 mm (9.84" x 1.69" x 8.27")
Embedded PCs Advantech EPC-T1232 dengan Procesor Intel® Core™ i ULT processor (BGA) hardisk mSata Conector Ethernet RJ-45. Hubungi sales@asp-automation.com untuk lebih jelasnya.